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SMT Processing / Patch Processing Basic Process Elements

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Published by: Keyou September 30,2019
Tags:
  • SMT,
  • PCB
  • The basic process elements of smt processing / patch processing:

    Silk Screen (or Dispensing) --> Mounting --> (Curing) --> Reflow Soldering --> Cleaning --> Testing --> Rework


    Silk screen: Its function is to print solder paste or patch glue on the pad of PCB to prepare for soldering of components. The equipment used is a screen printing machine (screen printer), located at the forefront of the SMT production line.


    Dispensing: It is a glue that drops the glue to a fixed position on the PCB. Its main function is to fix the components to the PCB. The equipment used is a dispenser located at the forefront of the SMT line or behind the inspection equipment.


    Mounting: Its function is to accurately mount surface-mounted components to a fixed position on the PCB. The equipment used is a placement machine located behind the screen printing machine in the SMT production line.


    Curing: Its function is to melt the patch glue, so that the surface-mount components and the PCB board are firmly bonded together. The equipment used is a curing oven located behind the placement machine in the SMT line.


    Reflow soldering: The function is to melt the solder paste, so that the surface-mount components and the PCB board are firmly bonded together. The equipment used is a reflow oven located behind the placement machine in the SMT line.

    Cleaning: The function is to remove the welding residue (such as flux) which is harmful to the human body on the assembled PCB. The equipment used is a washing machine, the position can be fixed, it can be online or not.

     

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