Hello! Welcome to Shenzhen Keyou PCB Co., Ltd!

Home / News /


Method for preventing warpage of PCB printed board
Published by: Keyou June 17,2019
1. Why the circuit board requirements are very flat In the automated instrumentation line, if the printed board is not flat, it will cause misalignment, the components can not be inserted into the ...
PCB board OSP technology introduction
Published by: Keyou June 11,2019
OSP is the abbreviation of Organic Solderability Preservatives. The Chinese translation is organic solder mask, also known as copper protector. It is also known as Preflux in English. Simply put, OSP ...
Method of deducing schematic diagram in PCB copying process
Published by: Keyou June 05,2019
In the research of PCB reverse technology, the reverse push schematic diagram refers to the reverse of the PCB file map or directly draws the PCB circuit diagram according to the physical object of th...
How is the foaming of the PCB surface caused?
Published by: Keyou June 04,2019
The blistering of the board surface is actually a problem of poor bonding of the board surface. The extension is also the surface quality problem of the board surface. This includes two aspects: 1. T...
How to copy the PCB?
Published by: Keyou June 03,2019
PCB copy board is also called circuit board copy board, circuit board cloning, circuit board copying, PCB cloning, PCB reverse design or PCB reverse research and development. There are many sayings ab...
FR4 pcb material
Published by: Keyou May 31,2019
FR-4 is a code name for a flame resistant material. It means a material specification that the resin material must be self-extinguishing after being burned. It is not a material name but a material gr...