Application specification of through hole design in high speed PCB board
We know that in high-speed PCB through-hole design, seemingly simple pcb through hole design often brings great negative effect to circuit design. So in the design, we should try todo the following
1.Choose the reasonable size of the PCB through-hole design from the consideration of cost and signal quality. For example, for the 6-10 layer memory module PCB through-hole design, it is better to choose 10/20mil (drilling/welding disc) through hole. For some small size boards with high density, you can also try to use 8/18mil PCB through-hole design. Under current technical conditions, it is difficult to use a smaller sizePCB through-hole design. For the power or ground wire through hole can be considered to use a larger size, to reduce impedance.
2.PCB through-hole design The use of thinner PCB board is conducive to reducing the two parasitic parameters through the hole.
4, power and ground pin to the nearest hole, hole and pin lead between the shorter the better, because they will lead to the increase in inductance. At the same time the power and ground leads should be as thick as possible to reduce impedance.
5. Put some grounding holes near the holes in the signal layer, so that the signal can provide the nearest loop. In addition, keep in mind that the process needs to be flexible, the PCB through-hole design model is the case that each layer has a pad, of course, we can also reduce or even remove some layers of the pad. In particular, when the density of pass hole is very high, it may lead to the groove of a partition circuit in the copper layer.PCB through-hole design At this time, in addition to moving the position of pass hole, we can also consider reducing the size of the welding disc of pass hole in the copper layer