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Multil<x>ayer PCB

Multilayer PCB

Monitoring equipment multilayer PCB
HDI-Multilayer-PCB-manufacture-in-China-customized.jpg_350x350
HDI-Multilayer-PCB-manufacture-in-China-customized (1)
HDI-Multilayer-PCB-manufacture-in-China-customized

Monitoring equipment multilayer PCB

Product Specification:
  • Min. Order : NO MOQ
  • PaymentTerms : T/T
  • Lead Time : 2 Week
See Price
  1. Product Details

Product type                     

6 layer pcb                            

Material                                         

FR4  TG170                                 

Field of application

 

Layers/thickness

6L/1.0mm

Line Space/width

4/3mil

Surface treatment

ENIG

Minimum hole dia.

0.2mm

Technical feature

impedance control

 

 

multilayer PCB

 

 

                                             Process capability     

                                     

Layer:                                              1 to 16 layers
Material type: FR-4,CEM-3,High TG,FR4 Halogen Free,RIGID-FLEX                      
Board thickness:                                     0.20mm to 3.4mm
copper thickness: 0.5 OZ to 6 OZ
copper thickness in hole:     >25.0 um(>1mil)
Max size of finish board:  700*460mm
Min.Drilled Hole Size: 1.0mm
Min.Line Width: 3mil
Min.Line Spacing: 3mil
Surface finishing:

HASL/HASL lead free,HAL,Chemical tin,Chemical Gold,

Immersion Silver/Gold,OSP,Gold plating

Solder Mask Color: Green/Yellow/Black/White/Red/Blue
Shape tolerance: ±4mil
Hole tolerance: PTH:±3mil,NPTH:±2mil
Package:

Inner paking/Plastic bag,Outer packing:Standard 

carton packing

Certificate: UL,SGS, ISO 9001:2008,IATF16949
Special requirements: Buried and blind vias+controlled impedance+BGA
Profiling: Punching,Routing, V-CUT,Beveling

 

 

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