HDI PCBs capitalize on the latest technologies available to increase the functionality of PCBs using the same or less amount of area. This advancement in PCB technology is driven by the miniaturization of components and semiconductor packages that supports advanced features in revolutionary new products. This includes touch screen computing, 4G network communications and military applications such as avionics and smart munitions.

HDI PCBs are characterized by high-density 
attributes including laser microvias, fine lines and high performance thin materials. This increased density enables more functions per unit area. Higher technology HDI PCBs have multiple layers of copper filled stacked microvias (Advanced HDI PCBs) which creates a structure that enables even more complex interconnections. These very complex structures provide the necessary routing solutions for today's large pin-count chips utilized in mobile devices and other high technology products.

HDI Structures:

1+N+1 - PCBs contain 1 "build-up" of high-density interconnection layers.HDI PCBs

i+N+i (i≥2) - PCBs contain 2 or more "build-up" of high density interconnection layers. Microvias on different layers can be staggered or stacked. HDI PCBs Copper filled stacked microvia structures are commonly seen in challenging designs.

HDI PCBs provides a reliable interconnect solution for highly complex large pin-count devices, such as CPU and GPU chips utilized on handheld and mobile devices